Bergquist Gap Filler TGF 2100LVO is a 2-component solution based on low volatile silicone technology. It offers an exceptional combination of robust dispensing, high reliability and excellent thermal conductivity.
With excellent wet-out properties and a typical nominal thermal conductivity of 2.2W/m∙K, it is a versatile solution to optimize heat dissipation. This makes it ideal for high-throughput manufacturing of automotive electronic control modules, components for ADAS applications and power conversion components such as OBC, DCDC, and Inverters. To minimise volatile outgassing, it has been formulated with an ultra-low volatile siloxane content and without D4-D5-D6 Siloxanes, thereby increasing sustainability and ensuring future REACH compliance.
“Our next-generation thermal gap fillers are the result of cutting-edge product development informed by close partnerships with the automotive supply chain. By working closely with Tier 1 & OEMs, we are developing solutions that allow them to balance complex, overlapping challenges,” explains Bart Van Eeghem, Business Development Manager Automotive Electronics EU at Henkel. “Developed with deep insight into the varied demands of automotive manufacturing, our next-generation gap filler portfolio offers targeted solutions for a wide range of applications. Bergquist Gap Filler TGF 2100LVO brings further expansion to this innovative range.”
On the production line, the robust dispensing properties and improved flowability of Bergquist Gap Filler TGF 2100LVO allow for increased efficiency. Greater versatility is ensured by the longer process window provided by its >120-minute working time, which also helps to reduce production line wastage – a further sustainability advantage. Bergquist Gap Filler TGF 2100LVO cures at room temperature in 24 hours, which can be accelerated with heat if wished.